Unconventional Patterning at the Nanoscale
NANOSCALE TOOLS
Cleaving Si Wafers
One of the most essential nanoscale skills is cleaving Si wafers. This skill with be practiced
in this lab exercise producing substrates that will be used in future patterning labs.
MATERIALS:
- Si (100) Wafers
- Wafer tweezer
- Diamond Scribe, petri dish
PROCEDURE: (Click on pictures to view the videos)
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Press firmly down on the flat edge (indicates orientation along (110)) of the
Si wafer using a diamond scribe while lightly holding a wafer tweezer on the opposite
side. The wafer should break nicely in a straight line in half.
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Follow the same procedure as above to cut each of the above halves into two.
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Cut the Si wafer into eight pieces. Carefully place these pieces in a labelled
petri dish for storage. These pieces will be used in future patterning labs.
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Authors:
Prof. Teri W. Odom,
Dr. M. Viswanathan and Y. Babayan
Institution:
Northwestern University
Evanston, IL USA
Level:
College and above
In the classroom:
This Course is a video lab manual for hands on fabrication and characterization of materials at the nanoscale.
Materials requirements range from simple chemicals, benchtop tools and CDs to necessary access to
advanced characterization equipment such as an Scanning Tunneling Microscope. |